エコー技研

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PRODUCT


Wafer Cleaning Equipment

The design, manufacture, and installation of cleaning equipment is our core business.
Our mainstay 300mm wafer cleaning equipment is available in a wide range of sizes, including 150mm, 200mm, and even 450mm wafer cleaning equipment.
In particular, we have the best track record in 300mm wafer cleaning equipment, having delivered final cleaning equipment to many silicon wafer manufacturers around the world.
The processing technology to clean 25 wafers + 25 wafers in 50 wafers with 5mm pitch between wafers is also our special technology.
SECS Communication (GEM, GEM300 compatible), SMIF, AGV & STOCKER, P&P linkage with OHT.
Various problems related to chemical treatment, particles, heavy metals, and organics are reliably solved.
For drying equipment, we propose our original drying equipment that uses neither S/D nor IP

Product Lineup

  • 300mm Pre-Cleaning Equipment
  • 300mm PostPolish Cleaning System
  • 300mm Post-DSP cleaning equipment
  • 300mm Epi Pre/Post Cleaning Equipment
  • 300mm Final Cleaning Equipment
  • 200mm Post EP cleaning equipment
  • 200mm Pre-Reactor Cleaning Equipment
  • 200mm Back Seal Cleaning Equipment
  • 200mm Pre cleaning equipment
  • 200mm Final cleaning equipment
  • 200mm KOH Etching Equipment
  • 200mm HNO3 Etching Equipment
  • 200mm HF Nitride Coating Removal Equipment
  • 200mm Amine Stripping Removal Equipment
  • 200mm Sputter Pretreatment Cleaning Equipment
  • 200mm Pre-diffusion Reactor Etching Equipment
  • 200mm Lift-off Cleaning Equipment
  • 200mm Alkaline Etching Equipment
  • 450mm Pre-Cleaning Equipment
  • 450mm Final Cleaning Equipment
  • Mirror Lens cleaning equipment
  • Fluorite Lens Cleaning Equipment
  • Resist Stripping Equipment
  • Quartz Tube Cleaning Equipment
  • SOI Wafer Cleaning Equipment
  • Organic Solvent Stripping Cleaner
  • IPA/VaporDryer
  • Surface Tensions StaticDryer
  • Chemical supply units (NH4OH, H2O2, HCl, HF, etc.)
  • Chemicalizer Products